Browsing Auburn University Graduate School by Author "Lall, Pradeep"

Now showing items 21-40 of 65

High Temperature Vibration Fatigue Life Prediction and High Strain Rate Material Characterization of Lead-Free Solders

Limaye, Geeta (2013-01-03)

Current trends in the automotive industry warrant a variety of electronics for improved control, safety, efficiency and entertainment. Many of these electronic systems like engine control units, variable valve sensor, ...

In-situ Electronics Measurement Using X-ray Micro-Computed Tomography System and Data Driven Prognostic Health Management

Wei, Junchao (2017-05-02)

In the 21st century, the electronics is everywhere and covers every aspect of human life. You can find it when watching TV, opening a laptop, or checking emails on a cell phone. Since 2015, 268 million PCs, 455 million ...

Initialization and Progression of Damage in Lead Free Electronics under Drop Impact

Iyengar, Deepti (2008-12-15)

Electronics may be subjected to shock, vibration, and drop impact during shipping, handling, and normal usage. Measurement of transient dynamic deformation of the electronic assemblies during shock and vibration can yield ...

Interfacial Damage Mechanics and Reliability at Multiple Electronic Interfaces under Harsh Environments

Pandurangan, Aathi Raja Ram (2025-01-13) ETD File Embargoed

Advanced electronic assemblies are expected to perform with greater reliability in mission-critical applications under harsh environmental conditions, including high G-shock loads (up to 25,000 g), thermo-mechanical stresses, ...

Interrogation of System State of Lead-Free Electronics Subjected to Mixed Sequential Steady-State and Cyclic Thermal Environments

Vaidya, Rahul (2010-11-04)

Electronic assemblies deployed in harsh field environments may be exposed to single and multiple thermal environments during their service life. In real world setting it is often required to know during the service life ...

Investigations on Damage Mechanics and Life Prediction of Fine-Pitch Electronics in Harsh Envirorments

Islam, Mohd (2005-08-15)

Increased use of sensors and controls in automotive applications has resulted in significant emphasis on the deployment of electronics directly mounted on the engine and transmission. Increased shock, vibration, and higher ...

IoT Sensors and Flexible Power Sources

Jang, Hyesoo (2024-08-05) ETD File Embargoed

In the burgeoning field of flexible hybrid electronics (FHE), which have attracted significant attention for their potential applications such as IoT sensors, flexible power sources, biomedical applications in sector of ...

Lead-Free Assembly and Reliability of Chip Scale Packages and 01005 Components

Liu, Yueli (2006-05-15)

Chip Scale Packages (CSPs) are widely used in portable and hand-held electronic devices due to their small size and availability. Consumers expect portable products to survive being dropped repeatedly, and drop testing is ...

Life Prediction in Leadfree Solder Joint and PCB Metallization Under Shock and Vibration

Angral, Arjun (2011-07-18)

In the age of portable communication devices, with electronics playing a vital role in all aspects of our daily lives, their reliability is of great concern to the industry. In the highly competitive portable electronics ...

Life Prediction Model of Electronics Subjected to Thermo-Mechanical Environments

Mirza, Kazi (2016-12-20)

Microelectronic assemblies used in automotive, military and defense applications may be subjected to extreme high and extreme low temperature in addition to temperature cycling with intermittent prolonged period of storage. ...

Material Characterization of Doped Lead-Free Solders at High Strain Rates and Extreme temperatures and Prediction of Mechanical Properties

Saha, Mrinmoy (2025-10-08) ETD File Embargoed

The reliability of solder joints remains a critical concern in advanced electronic packaging, particularly under harsh service conditions where high strain rates, extreme temperatures, and prolonged thermal aging accelerate ...

Material Characterization of Leadfree SAC Solder Alloys at High Strain Rates with Finite Element Analysis

Shantaram, Sandeep (2013-07-25)

The electronics may experience high strain rates under single, sequential and simultaneous exposure to thermo-mechanical and transient dynamics loads at various stages of their life-cycle i.e. manufacturing, transportation, ...

Material Characterization of Undoped & Doped Lead-Free Solders under High Strain Rates and Solder Joint Reliability for Combined Effects of Vibrations and High-Temperature Surroundings

Mehta, Vishal Arvindbhai (2025-05-01) ETD File Embargoed

In the rapidly advancing fields of automotive, oil exploration, and military electronics, components are increasingly required to operate under extreme conditions, characterized by high and low temperatures and transient ...

Material Factors Influencing Metallic Whisker Growth

Rodekohr, Chad (2008-12-15)

Whiskering refers to the formation of slender, long, metallic filaments, much thinner than a human hair, that grow on a metallic thin film surface. They are readily observed for pure and alloyed zinc (Zn), silver (Ag), ...

Material Property Evolution of Underfills Encapsulants, Electronic Molding Compounds, Thermal Interface Materials and Magnetic ACAs

Zhang, Yunli (2025-08-10) ETD File Embargoed

The evolution of material properties in electronic packaging plays a critical role in the reliability of semiconductor devices operating in harsh environments. This dissertation investigates the thermo-mechanical behaviors ...

Microstructure – Mechanical Property Relationships in Transient Liquid Phase Bonded Nickel-Based Superalloys and Iron-based ODS Alloys

Aluru, Sreenivasa (2006-05-15)

The research work presented here discusses the microstructure-mechanical property relationships in wide gap transient liquid phase (TLP) bonds, between the single crystal nickel-base superalloy CMSX-4 and two polycrystalline ...

Modeling and Reliability Characterization of Area-Array Electronics Subjected to High-G Mechanical Shock Up To 50,000G and Finite Element Analysis of Package on Package (PoP) Components for Warpage During Reflow

Patel, Kewal (2013-04-17)

Electronics in aerospace applications may be subjected to very high g-loads during normal operation. A novel micro-coil array interconnect has been studied for increased reliability during extended duration aerospace ...

Models for Thermo-Mechanical Reliability Trade-offs for Ball Grid Array and Flip Chip Packages in Extreme Environments

Hariharan, Ganesh (2007-05-15)

In the current work, decision-support models for deployment of various ball grid array devices and flip chip electronics under various harsh thermal environments have been presented. The current work is targeted towards ...

Principal Component Regression Models for Thermo-Mechanical Reliability of Plastic Ball Grid Arrays on Cu-Core and No Cu-Core PCB Assemblies in Harsh Environments

Shirgaokar, Aniket (2009-05-21)

In the current work, Goldmann constants and Norris-Landzberg acceleration factors have been developed for eutectic Tin Lead and Lead free solders (SAC 305) with the help of statistical tools including Principal Component ...

Prognostic Health Management and Additive Manufacturing Quality Analysis of Cables

Palmer, Devin (2025-05-01) ETD File Embargoed

Electrical systems regarding the transmittance of signals and data are under the constant threat of wear and tear. Many machines and systems that use cables to transfer signals and data are often used right up until failure ...